EPS Graduate Student Grant Program

Description

The IEEE Electronics Packaging Society (EPS) Graduate Student Grant Program supports emerging engineers and researchers who demonstrate strong potential in microelectronics packaging, heterogeneous integration, advanced interconnects, materials, reliability engineering, and electronics manufacturing.

The program recognizes students who actively contribute to the field through academic excellence, hands on projects, research involvement, and participation in IEEE/EPS activities. The goal of the program is to reduce financial barriers while encouraging students to deepen their technical expertise, engage with the global EPS community, and pursue impactful careers in electronics packaging and system integration.

Eligibility 

• Be an IEEE EPS Student Member in good standing (membership required before applying).
• Be enrolled as a graduate student at an accredited academic institution
• Be pursuing a degree related to electronics packaging, including electrical engineering, mechanical engineering, chemical engineering, materials science, semiconductor manufacturing, computer engineering, or industrial technology.
• As a part of the degree, be participating in research in electronics packaging.
• Demonstrate engagement with IEEE, EPS, and electronics packaging–related activities, such as webinars, technical workshops, chapter meetings, conferences, or industry events.    Volunteering in STEM activities to the communities also qualify.
• Provide proof of current academic enrollment.

Selection/Basis for Judging

• Demonstrated interest in electronics packaging research, manufacturing, or technology development
• Quality, clarity, and depth of the student essay
• Two letters of recommendation
• Academic performance and coursework relevant to microelectronics
• Participation in IEEE/EPS activities, student chapters, or technical communities
• Evidence of leadership, initiative, or contributions to the electronics packaging field

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